Editorial

• Research project exploring new materials to push boundaries of silicon-based electronics

  Scientists at the University of Freiburg (Germany), the Sustainability Center Freiburg, and the Fraunhofer-Gesellschaft are collaborating on a new research project that will test the feasibility of scandium aluminum nitride (ScAlN) as a new semiconductor for next-generation power electronics. details>>

• IBM Research unveils first integrated quantum system at CES 2019 and offers Cloud access

  At the annual Consumer Electronics Show (CES) in Las Vegas, the IBM Q System One quantum computer was revealed for the first time and explained that its computing power could be accessed by companies through the IBM cloud. details>>

• Researchers studying new semi-metallic materials that could enhance computer chips

  Electrical engineers from the University of Delaware (Newark, Del.) discovered that novel semi-metallic materials composed of alloys of tin and germanium have properties like Weyl semi-metals, which were initially theorized by physicists in the 1930s as massless particles that could carry a charge at high speeds and were recently detected in a unique class of materials. details>>

• Army researchers patent next-gen power modules for high-voltage electronics

  U.S. Army researchers, according to a report from TechLinkCenter.org, have patented a novel power module with integrated heat dissipation features that will enable high-powered electronics systems. details>>

• European researchers continue to find new aerospace applications for graphene

  Researchers from the Graphene Flagship and its many partners in academia and industry from across Europe are finding a number of new applications for graphene in aerospace, according to multiple reports. details>>

• Researcher talks about use of computer vision to ensure integrity of integrated circuits

  Integrated circuits (IC) are a building block for the electronics that are used on a daily basis around the world and it is critical for engineers and manufacturers to know that they are working with circuits that will meet specifications, which is why researchers at the Indiana Innovation Institute (IN3) are advancing computer vision for testing IC. details>>

• Samsung patents innovative system that uses audio devices to cool electronic devices

  According to a report from AdroidHeadlines.com, Samsung has filed a new patent for an audio device, essentially a speaker, which will act as a fan does in laptops or personal computers and be a cooling channel for electronic devices. details>>

• Researchers create silicone polymer coating that is capable of repelling ice from any surface

  Many in the Northeast and Midwest U.S., who are dealing with frigid temperatures and frozen windshields this time of the year, would be happy to hear that researchers at the University of Houston (Texas) made a breakthrough using stress localization to create a durable silicone polymer coating that will repel ice from any surface. details>>

• Huawei reveals Kunpeng 920, next-generation ARM-based CPU designed for servers

  Chinese telecommunications and electronics giant Huawei recently revealed its latest chipset, the Kunpeng 920, which is ARM-based and designed to enhance the performance of servers and cloud computing. details>>

• CTA announces that tech consumer revenue will be just shy of $400 billion in 2019

  The Consumer Technology Association (CTA), which organizes the annual Consumer Electronics Show (CES) that kicked off on Jan. 8 in Las Vegas, Nev., has released its semi-annual U.S. Consumer Technology Sales and Forecasts report and announced that the consumer technology market will set a new record of $398 billion in retail revenue in 2019. details>>