Editorial

• Analysts report that gallium oxide could be cost-effective material for future power electronics

  The National Renewable Energy Laboratory (NREL) in Lakewood, Colo. released the findings from a technoeconomic study of gallium oxide as a potential material for future power electronics and determined that it could be three to five times cheaper to manufacture than silicon carbide (SiC). details>>

• New liquid cooling solutions for servers debut at Open Compute Project Summit

  According to a report from DataCenterFrontier.com, liquid cooling companies Submer Immersion Cooling and ZutaCore debuted new technologies at the recent Open Compute Project Summit 2019 in San Jose, Calif. details>>

• Ultrafast lasers allow scientists to weld glass and metal together in new manufacturing process

  Scientists from Heriot-Watt University (Edinburgh, Scotland) demonstrated a new manufacturing process that utilizes an ultrafast laser system to weld glass and metal together, which could impact industries ranging from aerospace to optics to medical. details>>

• U.K. company producing graphene sheets at scales large enough for commercial electronics

  Paragraf, a company that recently spun-off from the University of Cambridge (U.K.), is producing graphene wafers that are up to eight inches (20 cm) in dimeter, which is large enough for commercial electronics. details>>

• Article explores recent research into next-gen heat exchangers for electronics cooling

  A recent article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering company based in Norwood, Mass., detailed recent research into heat exchanger technology and the ways that it is being implemented in electronics cooling applications. details>>

• Engineers develop, inexpensive smart stop sign to improve driver safety on rural roads

  Engineers from the University of Texas at San Antonio (USTA) designed a smart stop sign that uses infrared technology to sense oncoming vehicles and trigger a flashing system to alert motorists about the stop sign. details>>

• imec unveils new microfluidic, microchannel heat sink for high-performance chip cooling

  At the Embedded World Conference 2019 in Nuremberg, Germany, imec, an international research and development and innovation hub based in Leuven, Belgium, revealed a silicon-based, microchannel heat sink for high-performance cooling of next-generation chips. details>>

• UVA and Rolls-Royce partner to enhance efficiency of jet engines through thermoelectric materials

  The University of Virginia (UVA) School of Engineering (Charlottesville, Va.) and Rolls-Royce are partnering on a project to make jet engines more efficient by identifying and developing thermoelectric materials that will harness excess energy. details>>

• Article explores the benefits of using tubed or submerged-fin cold plates in electronics cooling

  The latest article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering firm based in Norwood, Mass., explores the developments in tubed and submerged-fin cold plates and how they are being used in electronics cooling applications. details>>

• University selected to lead million-dollar project to advance additive manufacturing processes

  Arizona State University (Tempe, Ariz.) has been selected by America Makes, a national accelerator for additive manufacturing, to lead a $1 million project to advance additive manufacturing postprocessing techniques, according to a report from the school. details>>