In response to the serious deficiencies of traditional thermal materials, new advanced materials are continually being developed, a number of which have thermal conductivity up to 1700 W/m-K with low densities and low coefficients of thermal expansion (CTEs): – What are the payoffs? – Do the advantages outweigh the disadvantages? – How are these new advanced materials currently applied? – What are the future directions? – How can they meet thermal, weight, and size requirements in a cost-effective way? – In what ways do they allow you to maintain a competitive edge?

This webinar is ideal for any engineers, scientist, or manager involved in microelectronic, optoelectronic and MEMS/MOEMS thermal management, packaging design, production and R&D, and material suppliers.

For more information on these topics please visit www.electronics-cooling.com.