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Archived Magazines » June 2005
Fan Failures and Unavailability
Fan Failures and Unavailability Some problems are associated with so many uncertainties that it is doubtful if a computed result is any better than a crude estimate. The issue for this article is a typical example.
details>>Pace Micro Uses Thermal and EMC Simulation to Boost Hard Drive Life
Pace Micro Uses Thermal and EMC Simulation to Boost Hard Drive Life Pace Micro Technology, United Kingdom, used thermal and electromagnetic compatibility (EMC) software to reduce temperature of a new set-top box by 5%, substantially increasing disk drive reliability and life. Alan Bate, senior design engineer....
details>>5th International Business & Technology Summit
5th International Business & Technology Summit This year's summit will feature in-depth and hour-long lectures by experts in various aspects of electronics cooling
details>>Q&A on Mikros NCP
Q&A on Mikros NCP We have been shipping our cold plate in sample quantities for a few months now and are encouraged by the response we have received from those who have evaluated the NCP. In one case, a client has succeeded in dissipating 1900 Watts/cm2 with our standard 10 mm x 20 mm cold plate.
details>>
Daat Research Corp. Partners with India’s Thermal Solution Provider, Waveaxis
Daat Research Corp. Partners with India’s Thermal Solution Provider, Waveaxis Daat announces licensing rep for India
details>>Moving to Liquid Cooling: Common Sense Design Considerations
Moving to Liquid Cooling: Common Sense Design Considerations A FREE workshop offered by Lytron at CoolingZone's Business & Technology Summit in August 2005
details>> Innovative Research Offers FREE Workshop at the Summit 2005
Innovative Research Offers FREE Workshop at the Summit 2005 Innovative Research will present Macroflow, an easy-to-use and computationally eficient software based on the Flow Network Modeling (FNM) approach for rapid system-level thermal design.
details>> Micro-Fabricated Solutions to Management of High Heat Flux Systems
Micro-Fabricated Solutions to Management of High Heat Flux Systems Removal of high heat fluxes is increasingly becoming the technology bottleneck in a wide variety of applications such as solid state lasers and diodes, telecommunication systems, and consumer electronics. Fundamental considerations indicate that .....
details>> A SHORT COURSE AT THE SUMMIT 2005: DESIGN OF LIQUID COOLING SYSTEMS
A SHORT COURSE AT THE SUMMIT 2005: DESIGN OF LIQUID COOLING SYSTEMS This short course presents a birds-eye view of liquid cooling technology. While liquid cooling is not at all new, most civilian electronics cooling applications have been air cooled for the last couple of decades.
details>> Choose category and click GO to search for thermal solutions
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