the power sources manufacturers association (psma) packaging committee is sponsoring an industry session at apec 2017 titled, “component, reliability and manufacturing innovations for 3d power packaging.”

featuring speakers from leading industry and research organizations, the session will present an up-to-date look at current and future component and manufacturing technologies utilizing high-density 3d packaging. the psma-sponsored session will take place on tuesday morning, march 28, from 8:30-11:55 a.m. in room 14 of the tampa convention center.

with the power supply industry continually being challenged to increase power density while lowering cost, companies are turning to 3d packaging technologies for additional solutions. a 3d packaging approach using embedded components (actives and passives) combined with advanced manufacturing technologies is proving to be the most reliable solution, offering the fastest time to market for achieving increased power density in a smaller footprint. this solution is already in production in semiconductor, component and power supply designs.

the 3d power packaging industry session will feature seven invited experts to provide attendees with an overview of reliability concerns, component technologies and manufacturing solutions essential for successful implementation. they will also offer insights to help attendees identify potential opportunities for their companies, and to explore the potential of applying this emerging technology to meet their market demands.

co-chairs of the session, ernie parker of crane of aerospace & electronics and brian narveson of narveson consulting, encourage industry professionals to attend the industry session on 3d power packaging.

parker stated, “this speaker session will provide a valuable opportunity for attendees to meet other professionals who are active in the evolving design, reliability and manufacturing of 3d embedded components in sub-assembly and power supply designs.”

narveson added, “we encourage everyone to register for apec 2017 and to make plans to attend the 3d power packaging session. participants should also consider joining the other psma-sponsored meetings being held throughout the week.”