carteret, nj — august 2015—led lighting has made a profound impact on the functionality and appearance of millions of consumer and commercial products. one of the most challenging issues when using leds is thermal dissipation. these lighting packages typically generate a significant amount of heat. if it is not managed correctly, this can severely limit the efficiency, output and useful life of the led.

one of most common ways to remove this performance-hindering byproduct is to use a heat sink. to maximize cooling performance, fujipoly® offers a full line of extremely soft, sarcon^® gr-ae thermal interface materials. these gap filler pads dramatically increase surface area contact between the component and heat sink.

the cost-effective silicone based material is available in nine thicknesses that deliver a thermal conductivity of 1.3 w/m°k with a thermal resistance as low as 0.50 °c cm²/w.  sarcon® gr-ae is available in pre-cut sheets up to 200mm x 300mm or can be die-cut to fit your exact application specifications.

fujipoly® contact:

frank hobler, tel: 732-969-0100, [email protected]