fujipoly's sarcon spg-30a is an ultra-low compression gap filler compound.  it is an easy to handle, high viscosity thermal silicone that is idea for filling large gaps between delicate circuit board components and a heat sink.  one of the key benefits of the compound is that it required minimal compression force.

key specifications:

• thermal resistance: 0.3 °cin2/w
• thermal conductivity: 3.2 w/m°k
• operating temperature: -40°c to 160°c
• conforms to almost any component shape
• protects fragile solder points
• remains form stable without heat curing

for more information, visit:  fujipoly sarcon thermal management components