want an ipad?   you've come to the right place! 

coolingzone  is holding a 2-day short course on the fundamentals of thermal management and you could be a winner of an apple ipad as a result of attending!   coolingzone has partnered with future facilities and advanced thermal solutions to bring you the course: "thermal management of electronics - calculations, measurements, simulation, review and selection of cooling options".

there are two parts to this outstanding program!  a design challenge and course in thermal management and electronics cooling

take the 6sigma cfd modeling challenge…win an ipad!

contestants will apply thermal modeling best practices learned in the coolingzone 2-day short course on thermal management of electronics in a live cfd model building contest.  compete against fellow mechanical engineers in a hands-on battle to design a heat sink thermal solution that will produce the lowest component junction temperature.

participants will use 6sigmaet, a new generation of electronics thermal simulation software from future facilities.  competitors will build a pre-defined system based on a common set of model parameters including boundary conditions, library items and materials.  choose the optimum combination of heat sink, thermal interface material, heat pipe and component location to keep vital components below their thermal limits.  no prior experience or training is required to model with 6sigmaet. 

register on-line at coolingzone.com to attend this informative and fun 2-day event and use your modeling skills to win an ipad courtesy of future facilities and may the best design win!

take the course: "thermal management of electronics - calculations, measurements, simulation, review and selection of cooling options".

coolingzone is pleased to announce our 2-day short course as led by dr. kaveh azar.  the course “thermal management of electronics – calculations, measurements, simulation, review and selection of cooling options” is a two day short course being held by coolingzone in san jose, ca and boston, ma.  the course is specifically tailored for engineers who require a principal understanding of electronics thermal management and need practical, focused methods for identifying optimal cooling solutions. this seminar is also suited to project managers, chief technical officers and other who want insight into the thermal design issues that affect product performance. 

the course is being held in two locations:

• december 3-4:  boston, ma, at the royal sonesta in cambridge, ma  click here to reserve a hotel room.
  
  

• december 6-7: san jose, ca at the future facilities office in san jose, ca  click here to reserve a hotel room. 
  
  

to register for either location, click to download our registration form, fill out and email us at [email protected] or call us at 508-329-2021

act now as early registration pricing saves you $300!  the course is $1,295.00 until mid-night 11/25, $1595.00 11/26 until the day of the course.  send more than one engineer and get a further 10% discount

attendees will be taken from the basic definition of electronics cooling and why thermal management is required; to how to calculate certain parameters; to how to accurately measure them;  and to where and how to use simulation tools like cfd, for effective thermal management. these includes:

• fundamentals of electronics cooling – what it is; why it needs to be considered; how it is approached and what needs to be considered.
  

• required calculations in thermal management – a set of calculations and respective procedures for analytical modeling of components, boards and systems.
  

• effective characterization – the role of measurement in thermal management – basic principles of measurement are examined and proper practices for temperature, velocity, pressure and heat flux are reviewed.
  

• the role of software in thermal management—cfd simulation-  understanding the fundamentals of cfd simulation and reviewing the best practices in modeling electronic components, boards and systems.

the course will also cover the features, selection and salient characteristics of different cooling systems.  these include:  selection and design of heat sinks and thermal interface materials, fan selection and characterization, and their role in electronics cooling. the use of vapor chambers and jet impingement for cooling of high power components and boards will also be reviewed. the session ends with an extensive review of cooling solutions that has been developed from vacuum tube to modern high power electronics. these include:

• heat sink design and thermal interface selection – this topic will feature a review of the process of heat sink design and selection and the role of thermal interface material in cooling of electronic components.

• fan characterization and its deployment in electronic systems –  this session will involve a review of fan types, their characteristics and best deployment practices. this will include an examination of how fan characterization is done and how to use fan curves for fan selection.
  

• vapor chamber and jet impingement for thermal management of high power electronics – a review of the design and operations of vapor chambers and how they are deployed in electronics components will be conducted. also included will be a look at jet impingement characteristics and its heat transfer benefits/shortfalls in tough-to-cool electronics.
  

• review of salient features of market-developed cooling solutions – in this period, an exhaustive review of cooling solutions that have been developed across the electronics industry will be presented. the review starts at the vacuum tube era and continues through to today’s sophisticated electronics. this presentation will encompass all market sectors:   from leds and consumer electronics to space and military applications.         

the main speaker will be dr. kaveh azar. dr. azar is is the president and ceo of advanced thermal solutions, inc. (ats), a leading edge thermal management company involved in developing liquid and air cooling solutions for the telecomm and computing market sectors. prior to ats, dr. azar was the founder and manager of lucent technologies thermal management center, responsible for developing the next generation of cooling systems. in addition, dr. azar has authored lucent’s thermal roadmap and served as the corporate thermal consultant. while at lucent, he developed a state-of-the- art thermal/fluids laboratory for simulation of components, boards and systems. since 1985, dr. azar has been an active participant in electronics thermal community and has served as the organizer, general chair and the keynote speaker at the national and international conferences sponsored by asme, ieee and aiaa.  dr. azar has received several recognitions within bell labs and other entities that include bell labs’ president silver award, strathmore’s who’s who, the uptime institute for visionary leadership and ieee semitherm significant contributor award in thermal management of electronics systems. 

interested in being a sponsor?  email [email protected] to learn how

to register, click to download our registration form, fill out and email us at [email protected] or call us at 508-329-2021