carteret, nj —monday, november 11, 2013—fujipoly’s new sarcon spg-50a sets a new performance standard for form-in-place gap filler materials by delivering a thermal conductivity of 5.0 w/m k. in addition, the new silicone-based compound exhibits ultra-low compression force making it ideal for applications that have delicate components or low compression requirements.

the form stable spg-50a material fills large gaps around fragile circuit board solder points without causing damage or loss in performance and efficiently transfers heat from any board-level source to a nearby heat sink or heat spreader. fujipoly’s newest thermal compound will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40c to + 150c). sarcon® spg-50a is available in easy-to-use tubes or syringes.

fujipoly of america corporation contact:
frank hobler  i  [email protected]  i  732-969-0100
see the sarcon spg-50a product page