coolingzone 2013 is just six weeks away.  the summit features leading experts in thermal management and electronics cooling.  topics covered include liquid cooling, advanced heat pipe design, thermal interface material, data center cooling and analysis, cfd, server design for electronics cooling, advanced manufacturing, vapor compression cooling, advanced manufacturing and more.  the program is designed to be both technically rich and practical, giving attendees solid information they can use to face the coming challenges in thermal management.

the list of speakers and topics includes:

• dr. vincent manno, provost and dean of faculty at olin college: "redefining engineering as a profession of innovation" click here for talk abstract
• dr. marc hodes, tufts university: "galinstan-based cooling of microelectronics:  beyond tuckerman and pease?" click here for talk abstract
• dr. kaveh azar, ceo, advanced thermal solutions: "state of the art in thermal management - from vacuum tube to super computers"
• dr. rich hill, laird: "meeting the challenges facing thermal materials suppliers through a new approach to technology, innovation, and intellectual property" click here for talk abstract
  
• bill pfeifer, sp3 diamond: "the commercial use of diamond heat spreader material for thermal management/heat transfer challenges" click here for talk abstract
  
• dr. philip blazdell, t-global technologies: "passive thermal management - challenges and directions for a lower cost of ownership solution"
  
• dr. sukhvinder kang, cto, aavid-thermalloy technologies: "new technologies maximize the cooling potential of heat sinks" click here for talk abstract
  
• ruben bons, cd-adapco: planes, trains, and automobiles….& electronics? click here for talk abstract
• dennis downs, colder products: "attributes of highly effective quick disconnect couplings for liquid cooling of computers and servers"  click here for talk abstract
  
• marie ross, future facilities: "thinking outside the box – server design for data center optimization" click here for talk abstract
  
• dr. ps lee, gcore labs: “high performance, energy efficient oblique fin liquid cooling technology for the effective thermal management of ev/hev battery pack and power electronics”. 
• jim burnett, aspen systems: "advances in miniaturized vapor compression electronics cooling"  click here for talk abstract
  
• yuya ando, cradle-cfd:  "simulating the future: how to tackle next generation thermal challenges with time efficient methods and techniques"
  
• jim vangilder, p.e., apc by schneider electric: "fast cfd for data center cooling design" click here for talk abstract
  
• dr. camil ghiu, advanced thermal solutions: "driving towards 0.1 degree c per watt in compact air cooled systems: advancements in flow management and air jet impingement cooling" click here for talk abstract
  
• sam bhayani, sinkpad: "challenges and solutions in led and solid state lighting thermal management"
• mike tozier, sapa group: "lowering aluminum heat sink and liquid cooler thermal resistance with friction stir welding” click here for talk abstract
  

readers of the coolingzone technical newsletter can get 15% off the cost of attending.  when registering use code cz2013-msps41.  the discount is good until september 21, 2013. click this link to register.

visit the coolingzone 2013 web page in order to learn more about the conference, find a hotel room and more.