fujipoly announces the introduction of sarcon® gr45a-00 a very low modulus thermal interface material with a low thermal resistance. this new formulation completely fills air gaps between components, board protrusions and recessed areas while exhibiting very low pressure. this allows greater surface contact with a heatsink and improves cooling performance.

when placed between a heat source such as a semiconductor and a nearby heat sink, this tim provides a thermal conductivity of 6.0 w/m°k per astm d2326 (4.5 w/m°k per iso/cd 22007-2 hot disk)  and a thermal resistance as low as 1.33°c cm²/w.  sarcon® gr45a-00 is available in convenient pre-cut sheets up to a maximum size of 200mm x 300mm (max.) and can also be die cut to your exact application specifications. material thicknesses from 0.5mm to 5.0mm can be specified in 0.5mm increments.

for more information please visit the fujipoly website