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August 2013

EMI Tape Company Releases New.24/2- UL-94 V-0 Silicon Thermal Pad equivalent to BERGQUIST GAP PAD VO Soft


emi tape company has just released their latest family of silicon thermal pad equivielnts to berquist product family. the  “silicon thermal pad equivalent to bergquist gap pad vo soft”


applications

silicon thermal pad are well suited to a wide variety of electronics and automotive applications such as:

• between an ic and a heat sink or chassis.

• between a semiconductor and heat sink

• cd-rom/dvd cooling

• hard drive cooling

• power supply

• signal amplifiers

• between other heat-generating devices and chassis

 

 

product listing: 

part no

thermal

conductivity

color

density

hardness

ul

  

gp-1 

1.0~2.0 

light 

gray 

1.7~1.9 

25~35 

v-0 

halogen free 

kgp-1 

3.0~5.0 

light 

gray 

1.8 

25~35 

v-0

halogen free

kgp-z

0.8

light

gray

1.2

15~25

v-0

halogen free

tr-z

-

light

gray

0.8

10~20

v-0

halogen free

tr-m

1.5

light

gray

1.8

30~35

v-0

halogen free

rm-2

-

gray or

black

 

60~70

v-0

halogen free

test method

jis

r2616

    

jis

k6251

ul-94

sgs

 

 

for questions or more information, please see:

tel : 82-51-506-7442

www.emitape.co.kr

richard: [email protected]

Choose category and click GO to search for thermal solutions

 
 

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