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February 2013

CTS Electronic Components announces a full line of heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance.


elkhart, in – february 4, 2013 – cts electronic components, incorporated (nyse: cts) announces a full line of heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance. these heat sinks are applicable for bga, pga, plcc, qfp and other ic packages.

forged heat sink series is a set of low profile, thin fin heat sinks. its height ranges from 6.3mm to 32.6mm with thermal resistance as low as 1.9°c/watt @ 200 lfpm convection flow conditions. these heat sinks attach to the integrated circuit via an adhesive tape or clip, whichever is appropriate for the application. as a result, they are easy to handle and require no special tools to assemble on the ic packages or additional holes on the pcb. cts’ line of forged heat sinks,  aer, apf, and apr series, are ideal for large ics with heat dissipation needs. 

 

forged_heat_sink_640_03


extruded heat sink series has a pre-applied adhesive tape that peels off and sticks onto the component. this attachment method reduces assembly cost and there are no messy adhesives or greases required.  the adhesive shear strength at 100°c is 36 psi - a one inch square heat sink would require a 36 lb. force to remove heat sink. thermal resistance for this product as low as 2.6°c/watt @ 400 lfpm forced convection flow conditions. cts’ bdn series is a cost effective alternative compared to conventional heat sinks. 

 

 

bdn_heat_sink_2614


“design engineers need effective solutions for the dissipation of heat from high performance
integrated circuits,” says terry luxmore, director of thermal products for cts. “cts’ full array of
heat sinks meet a wide range of thermal resistance demands with minimal assembly cost and
complexity.” for examples of real world applications, see avnet’s zedboardtm program where cts
heat sinks have been chosen for reference designs available at www.zedboard.org.


for more information on the aer, apf, and apr series and bdn series and other heat sinks that
offer cost effective solutions in both standard and customized configurations, please contact your
local cts sales representative or supporting cts inside sales representative or visit
http://www.ctscorp.com/components or call 630-577-8857. aer series, apf series, apr series, bdn series


about cts electronic components

cts electronic components is a leading provider of electronic components used in
communications, medical, defense and aerospace, industrial and computer applications for oems
and contract manufacturers worldwide. the company has manufacturing locations in
albuquerque, new mexico; hopkinton, massachusetts; nogales, mexico; singapore; zhongshan
and tianjin, china; and kaohsiung, taiwan.

about cts

cts is a leading designer and manufacturer of electronic components and sensors and a provider
of electronics manufacturing services (ems) to oems in the automotive, communications, medical,
defense and aerospace, industrial and computer markets. cts manufactures products in north
america, europe and asia. cts' stock is traded on the nyse under the ticker symbol "cts.” to
find out more, visit the cts web site at www.ctscorp.com.

safe harbor statement

this press release contains statements that are, or may be deemed to be, forward-looking
statements within the meaning of the private securities litigation reform act of 1995. these
forward-looking statements include, but are not limited to, any financial or other guidance,
statements that reflect our current expectations concerning future results and events and any other
statements that are not based solely on historical fact. readers are cautioned not to place undue
reliance on these forward-looking statements, which speak only as of the date hereof and are
based on various assumptions as to future events, the occurrence of which necessarily are subject
to uncertainties. these forward-looking statements are made subject to risks, uncertainties and
other factors, which could cause our actual results, performance or achievements to differ
materially from those presented in the forward-looking statements, including, without limitation:
changes in the economy generally and in respect to the businesses in which cts operates;
unanticipated issues in integrating acquisitions; rapid technological change; general market
conditions in the automotive, communications and computer industries, as well as conditions in the
industrial, defense and aerospace and medical markets; reliance on key customers; unanticipated
natural or other events such as the japan earthquake and floods in thailand; the ability to protect
our intellectual property; pricing pressures and demand for our products; and risks associated with
our international operations, including trade and tariff barriers, exchange rates and political and
geographical risks. for more detailed information on the risks and uncertainties associated with
cts’ business, see the reports cts files with the sec available at http://www.ctscorp.com/investor_relations/investor.htm. cts undertakes no obligation to publicly update its forward-looking statements to reflect new information or events or circumstances that arise after the date hereof, including market or industry changes.

 

contact:

cts electronic components
2375 cabot drive
lisle, illinois 60532
telephone: 630-577-8857

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