micro-faze is a new, revolutionary thermal interface film formulated with non-silicone thermal grease. it was developed by aos to offer the lowest thermal resistance in a thermal interface without the mess of grease. micro-faze does not require burn-in to form into place.  micro-faze is not phase change material.  it's benefits include:

• low thermal resistance with minimum force
• naturally tacky, non-silicone
• conforms with coefficient of thermal expansion
• (cte) deficiencies
• uniform film and exact thickness of thermal gease
• with each application
• no phase change required for heat transfer to take place—good low temp performance
• durable resistance over usable lifetime
• easily stored at a wide range of temperatures
•  

features and benefits

• retains all the performance advantages of thermal grease but in the form of a thermal pad
• requires minimum force to achieve total interface contact
• allows for total “wetting action” to fill all micoscopic surface voids without changing phase
• a positive coefficient of thermal expansion (cte) deficiencies the wetting action for total interface contact
• heat transfer takes place at any temperature (unlike phase change materials), making micro-faze an excellent choice for cold plate applications
• offers maximum heat transfer capability for
• power component
• excellent replacement for phase change materials and silicone pads
• is a “drop-in-place” product that is easy to use and handle
• in a manufacturing environment
• naturally tacky—no adhesive, fiberglass or other
• non-conductive material is used that may penalize
• thermal resistance
• microscopically changes to fill all micoscopic voids
• on part surfaces
• does not pump out!

for more information, contact:

 
aos thermal compound
http://www.aosco.com
22 meridian road | suite #6
eatontown, nj 07724
toll free (888)-662-7337