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product news
| | | touchstone semiconductor introduces the industry's only ultra low-power, load independent, high-efficiency boost
touchstone semiconductor, a leading developer of high-performance, low-power analog integrated circuit solutions, today announced the ts3300 boost...
| | | | unique nanoceramic-aluminum substrate for thermal management of electronics gains ground in industry [video]
cambridge nanotherm has developed and patented a unique nanoceramic-aluminum substrate for thermal management of electronics which offers the...
| | | | evga introduced brand new cooling design; the redefining evga acx cooler [video]
evga's new cooling design give a 40% increase in heatsink volume, the evga acx is more efficient at dissipating heat, allowing for 15% lower gpu...
| | | | coolermaster releases compact mainstream pc chassis with extensive water cooling support
coolermaster's n200 chassis is water cooling ready and improved air cooling performance wrapped in subtle and simplistic designs
| | | | ceramtec highlights ceramcool heat-sinks
ceramtec ceramic heat sinks are made from alumina and aluminum nitride and are targeted for high power electronics and led applications
| | | | avoid inaccuracies in thermal simulation with cd-adapco june 6th webinar [sponsored]
historically, thermal simulations of electronic systems have utilized dramatically simplified geometric versions of the systems. for many modern...
| | | | new dow corning dispensable thermal pads offer increased thermal performance, lower system costs for led lamps and luminaires
dow corning dispensable thermal pads are a new material that now enables led lamp and luminaire manufacturers to quickly and precisely print a layer...
| | | | new patented heat sink mounting system is industry first with secure click and latch
the new pem(tm) heat sink mounting system (patent pending) introduces an ideally engineered solution to securely attach heat sinks to circuit boards...
| | | | advancements in thermal management 2013 conference - june 6-7, denver. colorado [sponsored]
the advancements in thermal management 2013 conference will be held june 6-7, 2013 in denver, colo. highlighting the latest advancements in...
| | | | thermacore division k technology highlights encapsulated graphite for thermal management
advanced solid conduction concepts from k technology are used in thermal applications all over the world. among its primary thermal solutions, k...
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engineering how to
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how to properly select a heat sink long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set... |
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conferences & webinars
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advancements in thermal management (usa, co | 6-6-2013) the conference is designed for design engineers, system engineers, process engineers, material scientists and engineers, ctos and r&d managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states. |
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nasa thermal fluids and analysis workshop (usa, fl | 7-29-2013) tfaws is an annual training and professional development workshop designed to encourage knowledge sharing, professional development, and networking throughout the thermal and fluids engineering community within nasa and the aerospace community at large. |
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